Join a dynamic team as a technical lead, driving customer engagement and solution development in RF and microwave testing. Collaborate with sales and engineering teams to win complex opportunities and ensure customer satisfaction in a fast-paced environment.

Take ownership of customer engagements by providing technical solutions, driving project management, and cultivating long-term relationships within the semiconductor industry to optimize client success and satisfaction.

Address complex global tax controversy matters through effective audit strategies, engaging cross-functional teams, and delivering innovative tax solutions to optimize international business operations.

Drive innovation by developing Digital/DSP and mixed signal ASICs, enhancing product performance. Collaborate in a fast-paced environment, focusing on architecture, design, and verification of cutting-edge technology solutions.

Help us unlock the potential of next-gen System in Package (SiP) modules through innovative wafer fabrication processes and advanced packaging integration, supporting high-performance applications across multiple industries.