Advance your career by developing innovative mixed-signal IP designs that shape technology’s future. Collaborate across teams to enhance architecture, optimize performance, and drive power, performance, and area goals in cutting-edge projects.

Explore a pivotal role in shaping operational excellence, driving capacity strategies, and collaborating across teams to ensure agile manufacturing. Your insights and data-driven recommendations will influence critical decisions and enhance efficiency.

Lead cross-functional teams in developing innovative mixed-signal IP solutions. Drive execution from planning to delivery, ensuring quality and timely releases, while fostering collaboration across various technical domains and stakeholders.

Drive innovative substrate design from concept to production, optimizing performance and cost with a focus on collaboration across hardware, silicon, and design engineering teams. Be a key player in advancing packaging technology.

Elevate the future of semiconductor technology by driving yield improvements and product reliability. Collaborate with diverse teams to identify root causes and innovate solutions that enhance advanced electronic assembly manufacturing processes.