Elevate your career by contributing to the design and optimization of advanced analog and mixed-signal IP, collaborating with cross-functional teams to deliver innovative high-speed solutions for diverse applications in a dynamic engineering environment.

Develop cutting-edge analog circuits for advanced process nodes, collaborating with cross-functional teams to enhance performance, power efficiency, and area optimization for innovative mixed-signal IP solutions.

Tackle SOC physical design implementation, optimizing power and area metrics to transform RTL to GDS. Collaborate across teams to ensure high-performance products meet rigorous manufacturing standards and drive technological innovation.

Engage in the design and optimization of advanced ray tracing software, integrating across platforms to enhance capabilities and deliver innovative solutions for cutting-edge Intel products, collaborating with partners for maximum customer value.

Optimize die-to-wafer hybrid bonding processes and equipment, enhancing yield, reliability, and efficiency while leading innovative platforms in semiconductor manufacturing for technology advancements.