Drive innovative substrate design from concept to production, optimizing performance and cost with a focus on collaboration across hardware, silicon, and design engineering teams. Be a key player in advancing packaging technology.

Elevate the future of semiconductor technology by driving yield improvements and product reliability. Collaborate with diverse teams to identify root causes and innovate solutions that enhance advanced electronic assembly manufacturing processes.

Empower your career by applying advanced math and engineering to design innovative solutions for complex manufacturing and supply chain challenges. Collaborate across teams to enhance factory performance and optimize operations.

Drive the development of advanced substrate design from concept through tape-out, optimizing silicon-package performance and pinout. Collaborate closely with cross-functional teams to enhance design and production efficiencies.

Lead the charge in delivering cutting-edge analog and mixed signal IP, collaborating across teams to ensure timely execution and validation. Drive innovation and efficiency in integrated IP development for next-gen technologies.