Unlock potential by leading the design and strategy for high-density data center labs, ensuring alignment with business goals through innovative infrastructure solutions and collaborative project management across global teams.

Join a team that's at the forefront of 3D & 2.5D packaging technology, driving innovations in FPGA and ASIC product development. You will collaborate cross-functionally to optimize designs from conception to production, ensuring quality and reliability.

Join a dynamic team to lead infrastructure projects for advanced electronics R&D. Provide expert guidance and manage cross-functional teams, communicating effectively across all levels while ensuring project feasibility, budget adherence, and timely delivery.

Contribute to cutting-edge AI research that enhances engineering workflows and customer-facing solutions. Collaborate with cross-functional teams to identify high-impact AI opportunities and transform them into actionable prototypes and strategies.

Develop impactful go-to-market strategies with partners to enhance enterprise solutions adoption. Engage cross-functional teams to create integrated marketing campaigns, driving awareness and credibility for AMD's offerings.