As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a distributed team of professional Product Engineers managing a portfolio of outstanding Next Generation HBM products. The team is passionate about Quality, Cost, Cycle Time, and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually enhancing the efficiency of the HIG HBM PE organization. Responsibilities: - Collaborate with Advanced Package Technology team to enable sophisticated interconnect technology solutions that include wafer to wafer bonding. This includes working with Test Solutions team to enable the tests solutions, providing analysis of yield and electrical characteristics data. - Working with engineering teams on electrical failure analysis and develop DFT and characteristic data for sophisticated packaging solutions. - Work on EFA of advanced packaging failure, and extract and provide electrical and mechanical characteristics data. - Actively mentor and develop team members to cultivate growth and development within the team and the organization. - Work closely with various multi-functional teams, including Advanced Packaging, Design, Test Solution teams, Yield Engineering to ensure the multidisciplinary development and successful enablement - Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. - The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Minimum Qualifications: - Bachelors/Masters/Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field. - At least 10 of years' experience in semiconductor industry. - Deep knowledge of sophisticated package process/integration and DRAM or other memory. - Excellent data extraction, analysis and reporting skills (JMP or other tools). - Work on site in US with international travel to Singapore, Taiwan. Preferred Qualifications: - Familiar with memory's testing methodology. - Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs). - Strong record of collaborative work within/across teams to address sophisticated business and engineering problems. - Work on site in US with international travel to Singapore, Taiwan. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.