Job Description- Design and develop package and interconnect methods for Renesas's packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging.
- Develop Cu RDL with seed layer on IC wafer and FET and Backside metal deposit after grinding
- Wafer thinning development through Taiko BG and Glass carrier bond
- Define substrate, die interconnection through via, materials and PCB interface requirements
- Package technologies qualification for consumer & industrial power as well as automotive power applications.
- Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
- Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
- Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
- Resolve all process integration issues by ensuring all window checks are done on critical process steps.
- Establish production controls and monitor to ensure there is no room for quality incidents.
- Ensure smooth transition into production & implement ramp up monitor.
- Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
- Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
- Participate in packaging roadmap development & focus on execution.
- Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
- Establish & maintain package design rules
Qualifications- Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
- 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
- Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
- Strong interpersonal and communication skills.
- Strong analytical and presentation skills.
Additional InformationWe believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
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shape the future with us?
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