Sr IC Packaging Layout Specialist - (100% Remote)

Overview
Seeking an engineer with experience in package layout and electrical analysis, focusing on power distribution and high-frequency signal integrity.

Location: Remote (anywhere in US)
Full-time: Salary + Benefits + Bonuses / Contractor
Work Status: US Citizen or Lawful Permanent Resident.

Key Responsibilities
Develop and optimize package layouts
Perform PDN and signal integrity analysis
Run simulations and improve design performance
Collaborate with cross-functional engineering teams
Qualifications
Degree in Electrical Engineering or related field
10+ years of experience in package design and electrical analysis
Strong knowledge of power integrity and high-speed signal integrity
Hands-on experience with tools like Cadence APD, Cadence Clarity, Ansys HFSS, or similar (Siemens, Altium, etc.)
Experience with advanced packaging (2.5D/3D, flip-chip)

The anticipated annual base salary for this position is between $150,000 to $165,000, which also includes a comprehensive benefits package.

Full-Time Benefits:
• 15 days of PTO per calendar year
• 10 paid Holidays per calendar year
• Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
• Dental & Vision: Company covers 50% of premiums for Employee and Dependents
• Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
• Employee Assistant Program (EAP)
• 401k - Traditional & Roth
• Life/AD&D and Long-Term Disability
• Tuition reimbursement

LinkedIn :: https://www.linkedin.com/in/rtl2gds/ ( Are we connected?)