Sr Package Design & Electrical Analysis Engineer - (100% Remote)
We are seeking a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon. You will own the "silicon-to-board" interface, ensuring that advanced ASIC designs meet stringent signal integrity, thermal, and reliability requirements through expert simulation and innovative manufacturing.
Location: Remote (anywhere in US)
Full-time: Salary + Benefits + Bonuses / Contractor
Work Status: US Citizen or Lawful Permanent Resident.
Overview Seeking an engineer with experience in package layout and electrical analysis, focusing on power distribution and high-frequency signal integrity.
Key Responsibilities - Develop and optimize package layouts
- Perform PDN and signal integrity analysis
- Run simulations and improve design performance
- Collaborate with cross-functional engineering teams
Qualifications - Degree in Electrical Engineering or related field
- 10+ years of experience in package design and electrical analysis
- Strong knowledge of power integrity and high-speed signal integrity
- Hands-on experience with tools like Cadence APD, Cadence Clarity, Ansys HFSS, or similar (Siemens, Altium, etc.)
Preferred - Experience with advanced packaging (2.5D/3D, flip-chip)
- Strong problem-solving and communication skills
The anticipated annual base salary for this position is between $150,000 to $165,000, which also includes a comprehensive benefits package.
Full-Time Benefits: • 15 days of PTO per calendar year
• 10 paid Holidays per calendar year
• Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
• Dental & Vision: Company covers 50% of premiums for Employee and Dependents
• Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
• Employee Assistant Program (EAP)
• 401k - Traditional & Roth
• Life/AD&D and Long-Term Disability
• Tuition reimbursement
LinkedIn :: https://www.linkedin.com/in/rtl2gds/ ( Are we connected?)
