Job Title: Sr Engineer, Failure Analysis Engg (Manufacturing/Quality)
Job Requisition: 1010.603 / R263791
Job Location: Wilmington, Massachusetts
Job Type: Full Time
Rate of Pay: $171,787 - $180,810 per year
Duties:Responsible for the overall health of the products under Microelectromechanical Sensors (MEMS) and Inertial Measurement Units (IMU), including Failure Analysis support for issue resolution, quality/yield improvements, and technique development. Collaborate with design, test, product, and quality engineering teams to identify failure mechanisms and recommend corrective actions. Support customer returns, reliability assessments, and qualification efforts. Lead and execute failure analysis activities on semiconductor devices and systems, including electrical, physical, mechanical, and environmental failures. Drive continuous improvement in failure analysis methodologies and lab capabilities. Develop and support failure analysis documentation, including reports, presentations, and technical summaries. Mentor junior engineers and contribute to knowledge sharing across the team.
Requirements: Must have a Bachelor's degree in Electronics Engineering, Electrical Engineering, Materials Science, Physics, or related field (willing to accept foreign education equivalent) and five (5) years of experience in failure analysis or reliability engineering in the semiconductor or electronics industry.
Must also possess the following (quantitative experience requirements not applicable to this section):
- Demonstrated Expertise ("DE") performing evaluation and characterization using bench test equipment including signal generators, spectrum analyzers, oscilloscopes, and power meters controlled and automated by Python, LabView, and Zero Code GUI;
- DE with analog and mixed-signal ICs, MEMS sensors, IMU or automotive-grade components;
- DE performing mixed integrated circuit (IC) and modeling and simulation using Cadence and Avalon;
- DE performing failure analysis of analog and mixed signal integrated circuits by conducting fault isolation using techniques including OBIRCH, EMMI, TDR, X-Ray and Thermal Hotspot and leveraging principles of semiconductor device physics and transistor level analog circuit; and
- DE performing mechanical and chemical de-processing, parallel polishing, utilizing high-resolution scanning electron microscope (SEM) and focused ion beam (FIB) and related techniques including passive voltage contrast (PVC), Energy-dispersive X-ray spectroscopy (EDX), and in-situ nanoprobing to characterize and interpret the microstructure and material properties of the semiconductor device.
Contact: Eligible for employee referral program. Apply online at https://www.analog.com/en/careers.html and Reference Position Number: R263791.
- Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
- This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
