Summary of Role:

• As a Photonic Packaging Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
• Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
• Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
• Present technical updates and roadmaps to internal stakeholders and external partners.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
• 5+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Excellent analytical, problem-solving, and communication skills.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills.

• Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).
• Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
• Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).
• Familiarity with GF’s Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.
• Experience working with OSATs and managing external development partners.
• Demonstrated ability to lead cross-functional teams and influence technical direction.

Expected Salary Range

The exact Salary will be determined based on qualifications, experience and location.