Job Description

Work closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing

Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes

Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment

Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations

Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions

Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences

Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts

Test, troubleshoot and recommend improvements to advanced packaging assembly equipment

Identifies, analyzes and resolves system design weaknesses

Responsibilities

Bachelors Degree preferred in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging;

2+ years of experience in a related field;

Knowledge of the semiconductor packaging is a plus;

Hands-on, strong aptitude and deep understanding of highly advanced machinery;

Experience with Advanced Packaging (flip chip, die attach or thermocompression bonding) or semiconductor manufacturing highly preferred;

Strong data analysis skills

Candidates with higher qualifications may be considered for a more senior position

Position to be located in Rio Rancho (New Mexico)