POSITION SUMMARY

The R&D Process Development Engineer is a highly technical individual contributor responsible for developing, characterizing, optimizing, and scaling advanced manufacturing processes associated with Semi-Additive Plating (SAP) build up technology. Familiarity with Semi-Conductor or Fan-Out Wafer Level Packaging FOWLP process techniques is a plus as line and space characteristics are approaching historic Integrated Circuit sizes. Need for R&D engineering across four critical PCB fabrication disciplines: Mechanical Processing, Lithography, Electroplating, and Etching. This role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing - requiring both deep scientific rigor and practical manufacturing instincts.

This individual is expected to be the recognized technical authority within their focus areas - able to think outside of the standard and come up with solutions to complex problems, evaluate and set up new equipment and derive processes around those tools to achieve intended results.

This role requires someone equally comfortable running-controlled experiments in a laboratory and developing processes on small scale production manufacturing equipment- someone who bridges the gap between science and production with clarity, confidence, and technical credibility.

KEY RESPONSIBILITIES

Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D. Develop technology that can be scaled to provide solutions to customers across TTM's markets.

REQUIRED QUALIFICATIONS

Education

• Required: Bachelor of Science in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, or closely related discipline.
• Preferred: Master or PhD of Science in Chemical Engineering, Materials Science, or Electrical Engineering with a focus on electronic materials or manufacturing.

Experience

• Required: 3-8 years of hands-on process engineering experience in PCB manufacturing, or a closely related wet chemistry/precision manufacturing environment.
• Required: Direct, hands-on experience with at least two of the four focus areas: Mechanical, Lithography, Electroplating, or Etching.
• Preferred: Experience in semiconductor fab or FOWLP,

Technical Knowledge

• SAP: Fundamentals of SAP Build up or FOWLP technology including hands on experience.
• General: SPC, Design of Experiments (DoE), Cpk/Ppk analysis, failure analysis methodologies (SEM/EDS, optical microscopy, ICP-MS, XRF, FTIR), IPC standards (IPC-A-600, IPC-6012, IPC-TM-650, IPC-4552), ERP/MES systems, CAM software (Genesis, CAM350), SEMI Standards.

WORK ENVIRONMENT

• Primary Setting: PCB manufacturing facility - process engineering laboratory and production floor.
• Chemical Exposure: Regular work with hazardous chemicals including strong acids (H₂SO₄, HCl, HNO₃, HF), alkalis, copper sulfate, formaldehyde, photoresist chemicals, etchants, and plating bath additives.
• PPE Required: Chemical-resistant gloves, safety glasses/face shield, lab coat, acid-resistant apron, and additional PPE as required by SDS and EHS protocols.
• Physical Requirements: Ability to stand for extended periods; lift and carry up to 35 lbs; visual acuity for microscopic examination and precision measurement.
• Travel: Occasional travel to customer sites, equipment vendors, chemical suppliers, and industry conferences (10-20%).

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Compensation and Benefits:

TTM offers a variety of health and well-being benefit programs. Benefit options include medical, dental, vision, 401K, Flexible Spending Account, Health Savings Account, accident benefits, life insurance, disability benefits, paid vacation & holidays. Benefits are available 1st of the month following date of hire.

Compensation for roles at TTM Technologies varies depending on a wide array of factors including but not limited to the specific office location, role, skill set and level of experience. As required by local law, TTM provides a reasonable range of compensation for roles that may be hired in New York, California and Colorado. For California-based roles, compensation ranges are based upon specific physical locations.

Export Statement:
Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognition of Foreign Person visitors by badge differentiation; c) understand and follow authorization procedures for bringing foreign visitors into facilities (VAL); d) understand the Export and ITAR requirements for shipments leaving the US; e) manage vendor approvals for ITAR manufacturing and services.