Qualifications

• Bachelor's degree in Materials Science, Mechanical Engineering, or Industrial Engineering.
• Background in electronic assembly processes (preferred).
• Familiarity with MIL-STD, J-STD, or IPC Standards (preferred).
• Strong knowledge in materials science and failure analysis (FA) for chip-packaging related issues (preferred).
• Experience with root cause analysis using DOE methods (preferred).
• Knowledge of process optimization and Lean Six Sigma methodologies (preferred).
• Proficient in Microsoft Office and excellent communication skills (preferred).
• Environmental testing knowledge (thermal, shock, vibration) (preferred).
• Experience with 3D modeling and drafting software, preferably SolidWorks (preferred).

Responsibilities

• Support overseas manufacturing by resolving production, quality, and supply challenges while enhancing process efficiency.
• Conduct root cause and corrective action investigations on product failures using DOEs.
• Manage small to medium-scale capital projects including equipment selection and implementation.
• Create and review production documentation for accuracy and compliance.
• Evaluate new materials and conduct qualification runs.
• Establish supplier relationships to ensure quality materials and timely deliveries.
• Assist in new product development and facilitate scale-up from prototypes to full production.
• Travel domestically and internationally to production facilities as needed.

Benefits

• Health, dental, and vision insurance.
• 401K retirement plan.
• Disability and life insurance.
• Flexible spending accounts.
• Paid time off and 1/2 day Fridays.
• Additional perks included in a comprehensive benefits package.