Job DescriptionJob Summary:As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition using sputtering PVD and PECVD, and/or others for next generation infrared detector designs. Candidate will design and implement new processes and automate or improve existing ones to support aggressive technology development goals. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. This is the right place for a self-directed, goal-oriented, collaborative engineer. The work is varied and challenging where creative problem solving opportunities are many. Our culture is collaborative, supportive, and fun. The work environment is mixed general office and clean room/lab.
Primary Duties & Responsibilities:- Innovate new processes to enable the technology roadmap
- Design and execute experiments, analyze data, draw conclusions, document, and communicate results
- Establish feasibility of new processes with hands-on processing of pilot lots on production equipment
- Characterize results using quantitative metrology tools
- Automate or improve established processes
- Transition knowledge to sustainment engineers or technicians
- Specify, procure, and qualify new equipment as required to support development
- Work with tool design engineering to make fixtures or make tool modifications
- Document methods and workflows in MES-ready format
- Plan for statistical process control (SPC) practices as appropriate
- Evaluate production yield challenges and recommend improvements
- Collaborate with device physicists, research technicians, and test engineers to participate in overall product R&D cycle
Job Qualifications:- Bachelor's degree or equivalent experience in related technical discipline required
- 2+ years of related experience desired
- Proficient computer skills - Word, Excel & Outlook
- Ability to communicate clearly in written and spoken English
- Strong data analysis skills (fluency in Excel, MatLAB JMP, Python, SQL, or equivalent a plus)
- Experience with AMAT tools is desired: Centura, Endura
- Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistry
- Direct experience with one or more key wafer fabrication processes
- Familiarity and/or strong desire to learn microelectronic/semiconductor and MEMS fabrication techniques
- Applicants must be a U.S Citizen
Desired Background • Plasma tools for semiconductor or MEMS fabrication
• Infrared detector technology
• Statistical Process Control and Design of Experiments familiarity desired
• Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)
Salary Range: $90,800.00-$121,100.000
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
