Qorvo, Inc

Principal Mechanical Engineer

Qorvo, Inc$120K — $150K *
Aerospace & Defense
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's Degree in Mechanical Engineering or related field.
  • At least 12 years of experience in mechanical design of ruggedized electronics.
  • Expertise in FEA thermal and structural analysis.
  • Proficient in creating technical data packages (BOMs, 2D drawings, and 3D models).
  • Knowledge of Geometric Dimensioning and Tolerancing (GD&T).
  • Strong communication skills for cross-team collaboration.
  • Familiarity with Microsoft Office Suite.

Responsibilities

  • Collaborate with SSPA engineering teams and program leaders to ensure project success.
  • Design high-performance electronic and RF systems with rugged enclosures and components.
  • Create effective thermal management solutions for high-power electronic systems.
  • Choose materials and processes to meet product specifications across various objectives.
  • Identify risks through analysis and establish rigorous verification processes.
  • Conduct thermal analysis and structural evaluations of electronic systems.

Benefits

  • Opportunity to work on innovative high-power microwave and millimeter-wave technologies.
  • Engage in cross-disciplinary collaboration with various engineering and production teams.
  • Involvement in the full lifecycle of product design, from conception to testing.
  • Potential to impact military and aerospace technologies with rigorous specifications.
Full Job Description
You will be a Principal Mechanical Design Engineer with Qorvo's SSPA hardware engineering team, playing a pivotal role in the mechanical design and development of high-power microwave and millimeter-wave amplifiers, subsystems, and fully integrated LRUs, driving innovation, performance, and reliability across complex products and systems.

Your responsibilities will include:
  • Partner closely with SSPA engineering disciplines, senior program leadership, production, and quality teams to drive successful outcomes.
  • Design high-performance electronics and RF systems, including ruggedized enclosures, RF subassemblies, PCBAs, harnesses, and cables.
  • Develop efficient thermal management solutions for high-power electronics, including liquid cold plates and advanced air-cooling strategies (fans, blowers, and ram-air).
  • Select and specify materials, components, and manufacturing processes to meet size, weight, power, cost, environmental, and schedule objectives.
  • Proactively identify and mitigate risks through rigorous analysis and well-defined verification testing.
  • Perform detailed thermal analysis, from system-level modeling to die/channel temperatures; structural FEA analysis including shock, vibration, and acceleration assessments.

Basic Qualifications:
  • Bachelor of Science or Masters Degree in Mechanical Engineering or relevant discipline.
  • Minimum of 12 years experience in mechanical design of ruggedized electronics.
  • Demonstrated expertise in FEA-based thermal and structural analysis of electronics and electronics enclosures.
  • Strong background in technical data package development, including BOM creation, 2D drawings, and 3D modeling.
  • Working knowledge of GD&T (Geometric Dimensioning and Tolerancing).
  • Excellent written and verbal communication skills with the ability to collaborate effectively across teams.
  • Proficiency in Microsoft Office applications (Excel, Word, PowerPoint)..

Desired Qualifications:
  • Experience designing electronics packaging for microwave and millimeter wave circuits, modules and antennas.
  • Experience with military and aerospace specifications: MIL-STD-810, MIL-STD-461, DO-160.
  • Experience with Solidworks, Flotherm CFD, Ansys Structures FEA.
  • Proven ability to manage multiple tasks and programs.

This position is not eligible for visa sponsorship by the Company.

This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.

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About Qorvo, Inc

Qorvo, Inc is a semiconductor company that designs, manufactures, and supplies radio frequency (RF) solutions for smartphones, tablets, wireless infrastructure, defense and aerospace applications, and Internet of Things (IoT) applications. The company's products include amplifiers, filters, switches, and integrated modules that support a range of wireless communications standards. Qorvo was formed in 2015 as a result of the merger between RF Micro Devices and TriQuint Semiconductor. The company is headquartered in Greensboro, North Carolina.
Learn more about Qorvo, Inc
Size
8,900 employees
Market Cap
$9.1 billion
Industry
Net Income
$485.2 million
Founded
2013
5 Year Trend
+8.9%
Revenue
$3.7 billion
NASDAQ

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