Physical Design Engineer

DensityAI

$230K — $400K *
Consumer Technology
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • 8+ years of experience with advanced technology nodes (7nm or better)
  • Exceptional skills in full physical design flow including synthesis and signoff
  • Hands-on experience with industry-standard PD tools like Cadence Innovus and Synopsys Fusion Compiler
  • Proven collaboration with architects, RTL designers, and EDA vendors
  • (Optional) Knowledge of multi-die packaging and various signoff aspects (thermal, EM, signal integrity)

Responsibilities

  • Lead the physical design process for blocks of AI accelerator silicon
  • Utilize AI-assisted tool flows to expedite design processes
  • Coordinate with chip design and software teams to drive program success
  • Ensure design meets performance and signoff goals
  • Collaborate with foundries for complex chip signoff

Benefits

  • Medical, dental, and vision insurance
  • 401(k) plan
  • Standard paid time off
  • Equity grants based on company guidelines
  • Immigration support for visa and work authorization
Full Job Description
ITAR Notice: This role involves access to ITAR-controlled information. Applicants must be U.S. persons (U.S. citizens, U.S. permanent residents, asylees, or refugees) per 22 CFR 120.62.
About the role

Own floorplan-to-signoff physical design for one or more blocks of our AI accelerator silicon. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out.
What you'll do
  • Own floorplan-to-signoff physical design for one or more blocks of our AI accelerator silicon
  • Use and develop AI-assisted tool flows to accelerate physical design and signoff timelines
What we're looking for
  • Exceptional abilities across the full physical design flow (synthesis, place & route, CTS, signoff)
  • 8+ years of experience on very high performance designs at advanced technology nodes (7nm or better)
  • Hands-on with industry-standard PD tools (Cadence Innovus, Synopsys Fusion Compiler, or equivalent) and signoff (PrimeTime, Tempus, or equivalent)
  • Demonstrated ability to work closely with architects, RTL designers, EDA vendors, and foundries to design and sign off complex chips
  • (Optional) Multi-die packaging (CoWoS, 2.5D / 3D), thermal / IR / EM signoff, signal integrity, or DFT-aware physical design
Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

Full compensation packages are based on candidate experience and relevant certifications.

California pay range

$230,000-$400,000 USD

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