Summary of Role: This hands-on packaging integration role will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on assembly packaging inspection and characterization methods for SiPh Flip Chip packaging, including siph wafer level packaging features (v-grooves, cavities, bumps, RDL), assembly components (optical lens arrays, fibers, sockets, lids), and assembly process features (underfill fillets, chip edges). Focus on development of innovative methods to ensure product and module assembly manufacturability, cost, reliability, and performance.
Essential Responsibilities: - Develop and lead advanced inspection & characterization workflows for photonics packaging, including AOI, warpage analysis, and metrology across all assembly stages (die attach, underfill, lid attach, socket placement, fiber plug integration).
- Establish and transfer robust inspection, characterization, and quality methodologies into manufacturing, including packaging design rules, materials criteria, test structures, and participation in design reviews and FMEAs.
- Analyze data and partner cross-functionally to resolve technical, quality, and yield issues while driving global standardization, qualification rigor, and continuous improvement initiatives (CIP).
- Ensure product quality, safety, and compliance by supporting standardized quality processes, environmental health & safety requirements, and consistent global execution.
Other Responsibilities:Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications: - Education - Bachelors or Master's degree in Materials Science, Mechanical Engineering, Applied Physics, or related field from an accredited degree program.
- Experience -1-3 years of experience in semiconductor packaging, inspection, and physical characterization.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency - English (Written & Verbal)
Preferred Qualifications: - Prior related internship or co-op experience
- Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
- Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills
- Strong planning & organizational skills
- Hands-on experience with photonics and advanced packaging technologies, including 2.5D, 3D, and 3.5D packaging, optical packaging, and failure analysis of electronic packages.
- Strong technical expertise in physical characterization and inspection, with experience using tools such as AOI, profilometry, SEM, X-ray, and acoustic microscopy, along with advanced characterization methods.
- High curiosity with strong communication skills, including the ability to document work clearly in English and stay informed on global technology and commercial trends.
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Expected Salary Range$65,400.00 - $145,800.00
The exact Salary will be determined based on qualifications, experience and location.
