PCB Layout Engineering Lead

Cerebras Systems

$210K — $230K *
US-AnywhereRemote in Sunnyvale, CA
Telecommunications & Hardware
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in electrical or electronics engineering or related field, or equivalent experience.
  • 10+ years of hands-on experience with complex, high-speed, multilayer PCB layouts.
  • Expertise in Cadence Allegro PCB Designer and Constraint Manager; familiarity with Altium Designer is a plus.
  • Strong knowledge of controlled-impedance routing, differential pairs, and power distribution.
  • Experience with dense BGA routing and advanced PCB structures such as HDI, blind and buried vias.
  • Working knowledge of signal integrity, power integrity, and thermal design principles.
  • Ability to create and review complete PCB fabrication and assembly release packages.

Responsibilities

  • Own multilayer PCB layout from initial component placement to fabrication release.
  • Translate engineering requirements into constraint-driven board designs using industry-standard tools.
  • Define board stackups, routing rules, and electrical constraints.
  • Place and route high-speed and sensitive circuits effectively.
  • Apply best practices to optimize signal and power integrity.
  • Collaborate with various engineering teams to resolve layout issues.
  • Coordinate with fabrication partners to improve yield and costs.
  • Perform design reviews and ensure quality checks for manufacturing outputs.

Benefits

  • Remote working option available; hybrid working in Sunnyvale, CA preferred.
  • Opportunity to work on groundbreaking advancements in AI technology.
  • Collaboration with multi-disciplinary teams across various engineering domains.
Full Job Description
Cerebras is seeking an exceptional PCB Layout Lead to own the physical implementation of complex, high-performance printed circuit boards for AI systems. This role will translate schematics and engineering requirements into production-ready layouts, optimizing signal integrity, power integrity, thermal performance, reliability, and manufacturability.

Responsibilities
  • Own multilayer PCB layout from initial component placement through fabrication and assembly release.
  • Translate schematics, mechanical constraints, and electrical requirements into constraint-driven board designs using industry-standard PCB layout tools.
  • Define and implement board stackups, controlled-impedance structures, routing rules, reference planes, return paths, and length- and phase-matching constraints.
  • Place and route high-speed digital, high-current power, and sensitive analog circuits, including dense BGA fanout and differential interfaces.
  • Apply signal-integrity and power-integrity best practices to minimize crosstalk, discontinuities, noise, voltage drop, and electromagnetic interference.
  • Collaborate with electrical, SI/PI, mechanical, thermal, compliance, manufacturing, and test engineers to establish constraints and resolve layout issues.
  • Work with fabrication and assembly partners to select materials, validate stackups and via structures, and improve yield, cost, and schedule.
  • Perform design reviews and DFM, DFA, and DFT checks; generate and verify fabrication drawings, assembly drawings, drill data, Gerbers, ODB++, IPC-2581, and related release packages.
  • Maintain component footprints, padstacks, design libraries, layout standards, and release documentation.
  • Support prototype builds, board bring-up, failure analysis, and layout revisions through production.

Minimum Qualifications
  • Bachelor's degree in electrical engineering, electronics engineering, or a related field, or equivalent practical experience.
  • 10+ years of hands-on experience laying out complex, high-speed, multilayer printed circuit boards.
  • Expertise with Cadence Allegro PCB Designer and Constraint Manager; experience with Altium Designer or equivalent tools is also relevant.
  • Strong knowledge of component placement, controlled-impedance routing, differential pairs, length matching, return-path continuity, and power distribution.
  • Experience with dense BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, and backdrilling.
  • Working knowledge of signal integrity, power integrity, EMI/EMC, thermal design, creepage and clearance, and high-current routing.
  • Experience applying IPC standards and fabrication, assembly, test, and manufacturability requirements.
  • Ability to create and review complete PCB fabrication and assembly release packages.
  • Ability to thrive in a fast-paced, dynamic environment and adapt to changing priorities.
  • Excellent collaborative and interpersonal skills with multi-disciplined teams.
  • Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, enterprise product, GPU, CPU, TPU, server platform etc.

Preferred Qualifications
  • Experience designing large, high-layer-count boards for compute, networking, server, or AI accelerator systems.
  • Experience routing high-speed interfaces such as DDR4/DDR5, PCIe Gen4/Gen5 or later, Ethernet, USB, and multi-gigabit SerDes.
  • Experience with high-current, low-voltage power delivery, VRM placement, decoupling strategy, copper balancing, and thermal optimization.
  • Experience developing Allegro SKILL, scripts, or automation that improves layout quality and release efficiency.
  • Demonstrated success delivering first-pass functional boards and supporting products from prototype through volume production.

Location: Remote. Sunnyvale, CA (Hybrid) is highly preferred.
  • The base salary range for this position is $210,000 - $230,000+ annually. Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

Apply today and become part of the forefront of groundbreaking advancements in AI!

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