Join a team pushing the limits of laser technology. As a Packaging Engineer, you’ll own critical processes that turn cutting-edge diode laser devices into production-ready powerhouses—driving performance through precision mounting, bonding, and interface characterization.

You’ll be the go-to expert for key production tools and processes, championing uptime, stability, and continuous improvement while partnering closely with R&D to bring new concepts to life on the factory floor.

What you’ll do

• Own and optimize die bonding and wire bonding processes and tools for high‑power diode lasers.
• Lead interface characterization and packaging process tuning based on optical KPIs (power, voltage, slow axis, smile, placement accuracy, etc.).
• Take full ownership of production equipment: process control, sustaining, tool uptime, and maintenance troubleshooting.
• Drive yield improvement and cost reduction initiatives; spot yield excursions fast and implement robust corrective actions.
• Lead and contribute to 4D/8D problem-solving and shepherd ECNs, including MES/Database updates.
• Partner with R&D to industrialize new processes; define qualification plans and specifications for new equipment and methods.
• Use SPC, MSA, DOE, and JMP/Minitab to deliver data‑driven process improvements.
• Tackle complex equipment and process issues with structured troubleshooting; deliver high‑quality results on time.
• Communicate clearly, influence cross‑functional teams, and mentor peers while executing well‑defined tasks with guidance as needed.

What you bring

• BS or MS in Mechanical/Electrical Engineering, Materials Science, or Physics.
• 3+ years hands‑on with die attach, thermocompression bonding, wire bonding, vacuum reflow, and pick‑and‑place.
• Manufacturing support experience in lasers or semiconductors (preferred).
• Familiarity with K&S or F&K wire bonders, and/or SET die bonders (plus).
• Strong with JMP, Minitab, or similar statistical tools; fluent in SPC/DOE/Six Sigma/problem solving (certification a plus).
• Proven track record driving cross‑functional issue resolution and leading teams.
• Comfortable in a cleanroom environment (gowning required).
• Excellent communicator who gives and receives feedback constructively.

Why this role

• Impact: Your processes directly shape performance in advanced laser products.
• Variety: From sustaining and yield to ECNs and new‑process quals—no two days are the same.
• Growth: Work at the intersection of production and R&D with room to lead.

Pay Range: $93,253.50 - $112,504