We are seeking a highly motivated Staff Packaging Engineer with the capability to lead advanced integrated circuit (IC) packaging development and manage the introduction of new product technologies. The ideal candidate will drive innovation in packaging for Data Center, AI, Power Management, Compute, and emerging markets, ensuring the transfer of these technologies into high-volume manufacturing with assembly suppliers. Extensive expertise in Flip Chip, Wire Bond, and System in Package (SiP) assembly processes, as well as familiarity with related materials and equipment, is required. The role demands strong leadership in multi-functional teams and the ability to solve complex technical problems, especially when collaborating with multiple Outsourced Semiconductor Assembly and Test (OSAT) providers. Experience with Wafer-on-Wafer bonding is considered a plus. Duties and Responsibilities • Explore, develop, and deploy FCCSP, FCBGA, and/or SiP/Module packaging technologies for high-volume manufacturing. • Initiate and define package process flows, material sets and Best Known Methods (BKM), test vehicles, Design of Experiments (DOEs) and cornering, and process control plans to ensure the successful development of manufacturable and reliable products. • Interface with OSATs, substrate and material suppliers, and tool makers to develop technology in alignment with product requirements. Coordinate with internal product teams on establishing Design Rules. • Collaborate with the internal design team and promote Design for Manufacturability (DFM) methodology for new technologies. • Work with internal design, modeling, and procurement teams to implement packaging solutions that are technically optimal and cost-effective. • Manage technical programs, including planning, execution, and monitoring of complex processes or product developments. Provide regular updates on program status to management and share progress with cross-functional team members. • Demonstrate strong knowledge and understanding of Failure Mode and Effects Analysis (FMEA), Statistical Process Control/Quality Control (SPC/QC) concepts, failure mechanisms, failure analysis techniques, manufacturing floor operations, and quality issue resolution. The Ideal candidate will have • At least 8+ years of experience in the development and high-volume manufacturing of advanced IC packages. • Expertise in Flip Chip CSP, FCBGA, and SiP packaging materials, assembly processes, equipment, and design rules. • Strong understanding of Laser Groove technology and Wire Bond process optimization. • Excellent verbal and written communication skills. • Demonstrated ability in organized technical project management. • Capable of working independently and leading multiple programs. • Able to lead multi-functional teams to address complex technical challenges. • Self-driven, passionate, and creative. Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. Preferred Qualifications • Hands-on experience in package manufacturing, technical project management, and direct collaboration with semiconductor material suppliers. • Understand industry packaging trends, end-user packaging needs, and prior experience with high-end mobile consumer products. • Proficiency in material and package characterization and statistical data analysis. • Familiarity with reliability test methods and qualification procedures. • Six Sigma Green or Black Belt certification is a plus. Educational Requirements • Required: Bachelor's degree in electrical engineering, Mechanical Engineering, Materials Science, Chemical Engineering, a related field, or equivalent practical experience. • Preferred: Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related engineering field. Pay range and Other Compensation & Benefits: $127,200.00 - $190,800.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.