Position Summary

To support this ambition, we are seeking an Operations Engineer - Displays as part of the Acron Avionics Business Unit, based on-site in Grand Rapids, MI.

This role is focused on driving Zero Defects in the middle of the manufacturing process, where design intent meets production reality. The Operations Engineer owns Rolled Throughput Yield (RTY) performance for the Displays product line and uses RTY and defect data to frame, prioritize, and lead continuous improvement initiatives. These efforts are aimed at eliminating systemic defect drivers, stabilizing manufacturing and test processes, and structurally removing cost from both product and process, rather than relying on inspection, rework, or short-term containment.

This position requires practical experience in Circuit Card Assembly (CCA) design to diagnose manufacturing defects arising from marginal design decisions, component selection, layout sensitivities, or testability limitations. Operating in a complex, regulated avionics manufacturing environment, the role partners closely with Manufacturing, Test, and Operations, and works in tight collaboration with Quality, who owns first-mile and last-mile quality including supplier and customer-facing issues. The Operations Engineer leads defect resolution within the factory, ensures corrective actions are permanent and prevention-based, and applies design-informed manufacturing insight to strengthen process robustness and execution.

Rolled Throughput Yield Ownership & Analytics

• Own Rolled Throughput Yield (RTY) for the Displays product line, including analysis by process step, failure mechanism, and product variant
• Identify leading indicators of RTY degradation (repeat defects, rework loops, test fallout) and act before yield loss escalates
• Develop RTY loss trees and defect paretos to focus improvement activity on highest-impact opportunities

Defect Resolution

• Lead structured defect resolution for manufacturing, integration, calibration, and test-induced failures
• Drive cross-functional root cause analysis and corrective actions relating to factory failures in collaboration with Manufacturing, Manufacturing/Test/Design Engineering, Operations, and Quality
• Partner with Quality Engineering to provide deep manufacturing and CCA-specific technical insight to Quality-led investigations
• Collaborate with Manufacturing Engineering and Test Engineering to address CCA-related defect drivers through improved process controls, screening strategies, test conditions, or work instructions
• Apply CCA-level design knowledge (schematics, layouts, component behavior, and manufacturing interfaces) to identify defect root causes related to soldering, component sensitivity, layout robustness, thermal effects, and test access

Continuous Improvement & Cost Takeout

• Use RTY and defect data to frame continuous improvement projects that eliminate waste, rework, and non-value-added process steps

Required Qualifications

• Bachelor's degree in Engineering (Manufacturing, Electrical/Computer, Mechanical, Systems, or related). Electrical/Computer Engineering preferred.
• 3+ years of experience in manufacturing, operations engineering, production engineering, or sustaining engineering
• Demonstrated experience improving yield (RTY/FPY) and resolving systemic defects in a complex manufacturing environment
• Hands-on experience with Circuit Card Assembly (CCA) at the design-manufacturing interface, such as Design for Manufacturing (DFM) support, electronics troubleshooting, sustaining engineering, or manufacturing support
• Ability to interpret schematics, layouts, and component behavior to assess impact on manufacturability, testability, and RTY
• Strong structured problem-solving capability (i.e. A3, 5-Why, Fishbone, PDCA)
• Experience partnering with Quality, Manufacturing, and Test in a regulated environment (Aerospace, Defense, Medical, Automotive, or similar)

Preferred Qualifications

• Experience with avionics, displays, electronics, or electro-mechanical assemblies
• Prior involvement with high-reliability CCA manufacturing (IPC Class 3, AS9100 environments)
• Familiarity with common CCA defect mechanisms (solder joint reliability, thermal stress, component derating, layout-induced sensitivity, test-induced failures)
• Exposure to Lean Manufacturing, Continuous Improvement, or formal operating systems