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This is a hybrid role that can be performed three days per week from our Ottawa office.
Meet the Team
Acacia designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G, 800G and 1.6T+ bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks. You will work with other Acacia mixed-signal engineers to collaborate in order to provide an optimized design that will integrate into the ASIC. In addition, you will have the opportunity to interact with other Acacia groups including digital/DSP design, system design, package design, and module design. Acacia takes pride in providing and fostering a collaborate environment in order ensure success and personal growth.
Your Impact
As a member of the Mixed Signal Design team, you are a member of a small, dynamic IC Design group that develops high speed ()25Gb/s), and high accuracy, analog designs for optical communications products. You will design, layout, measure and productize ultra-deep sub-micron-based CMOS products.
You will work with section lead and team members to design blocks on a complex chip and track deliverables, participate in peer review of complex IC designs and provide solid design methodology from conception to production.
You will also collaborate with section lead to ensure signal and power integrity specifications are met.
You are enthusiastic about developing high speed AMS circuits and best-in-class products that push the boundaries of what is possible.
You are detail oriented, high energy and the drive to get things done and solve difficult problems.
You are capable to figure things out by yourself, but you also participate in our friendly and team-oriented collaboration approach, which means you enjoy learning from your colleagues and letting them learn from you.
You are not shy to always point out how we can be more effective as a team, and you are open to similar suggestions by your team members.
Minimum qualification:
Bachelors + 5 years of related experience, or Masters + 3 years of related experience, or PhD + 0 years of related experience.
Experience in design, simulation and measurement of high speed ICs in at least 3 of the areas listed below:
* High Speed Serial Links utilizing serializers, deserializers, and data convertors.
* Modeling requirements for system link simulations
* High Performance Output Drivers* High Performance Phase Locked Loops
* Efficient clock transmission/propagation.
* Opamps and Programmable Gain Amplifiers.
* Equalization techniques.
Preferred Qualifications
Experience with electrical transceiver applications including backplane and cable communications.
* Experience in FinFET and GAA technologies.
* High-frequency layout experience including floorplaning (power/ground, digital/analog signal routing), passives components (inductors, transformers, and transmission-lins).
* Experience in design for manufacturability including characterization over PVT, electromigration analysis,self-heating, and IR drop analysis.
* Experience in laboratory validation including ESD practices/methodology and construction of test setups.
* Experience in design software including Cadence (Virtuoso), Specture/APS/SpectreX, layout validation tools (Virtuoso and Calibre), EMX, mixed-signal simulations in AMS, and Matlab.
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