Job Description Summary:
The Microsystems Integration Group is seeking staff for design and manufacturing process development of multi-die, micron-scale electronic systems for research, commercial, and national defense applications. The candidate will be part of a team that employs both industry-standard and bespoke methods of electronics packaging including precision component alignment, bonding, 3-D electrical connect, and ruggedization applied to functional low rate production end products.

Experience in a microfabrication and/or micro-assembly laboratory environment and excellent communication and analytical skills are required. Familiarity with concepts in heterogeneous electronics integration and packaging are desired. The candidate should understand microelectronics metrology techniques such as SEM, X-ray, and optical microscopy. The role will support multiple interdisciplinary programs and will require a candidate who is comfortable conducting experiments, analyzing data, and presenting results. System design and experience on multidisciplinary team including vendors and external technologies is critical.

The candidate should have a background in electrical, mechanical, chemical, and/or materials engineering and have demonstrated examples of self-driven efforts in technical areas outside their academic training. The candidate will work in a diverse team-based environment alongside technical staff of varying levels of expertise to execute technical tasks and communicate technical matters to engineering and management.

Job Description:

Duties/Responsibilities
• Designs and develops Microelectromechanical devices/sensors, schematics and physical layouts of integrated MEMS components or packaged assemblies.
• Assesses performance and process capabilities of potential MEMS device designs using modeling or simulation software.
• Tests and evaluates devices using a variety of tools, protocols, and software.
• Analyzes and addresses issues such as reliability, yield improvement, and/or failure.
• Develops production methods and fabrication processes for MEMS.
• Drafts documentation such as operating instructions, performance specifications, and manuals.
• Shares performance experience and operating characteristics with designers or other engineers for new product development purposes and/or training.
• Develop and maintain effective internal/external relationships.
• Independently execute task assignments under the oversight of program leadership and/or senior staff.
• Contribute content for technical reports and presentations with appropriate guidance.
• Adapt appropriately to changes in program requirements.
• Identify challenges and risks associated with assigned tasks and communicate them to project leadership.
• Performs other related duties as assigned.

Skills/Abilities
• Excellent verbal and written communication skills.
• Excellent organizational skills and attention to detail.
• Excellent time management skills with the proven ability to meet deadlines.
• Strong analytical and problem-solving skills.
• Proficient with the fabrication and metrology tools and instrumentation related to MEMS component fabrication
• Proficient with software tools and systems used for device design, modelling, and performance testing
• Proficient with software tools and systems used for statistical process control, and reliability and failure analysis, including yield improvement

Education
Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Physics required. Master's degree preferred

Experience
0-3 years of Microsystems Engineering or related experience.

Additional Job Description:

This position will require the ability to obtain a US Security Clearance. Minimum requirement for a security clearance is US citizenship.

Job Location - City:
Cambridge

Job Location - State:
Massachusetts

Job Location - Postal Code:


The US base salary range for this full-time position is
$62,500.00 - $237,500.00
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Union ranges will be in compliance with the collective bargaining agreement's approved rates by location and role. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and does not include bonuses or benefits.

Our work is very important to us, but so is our life outside of work. Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities. If this specific job opportunity and the chance to work at a nationally renowned R&D innovation company appeals to you, apply now www.draper.com/careers.