Summary of Role: As a Process Integration Engineer focusing on BEOL (Back End of Line) you will be part of the BEOL Integration department, participating in developing, maintaining and improving advanced high-volume manufacturing technologies in GF's state-of-the-art 200mm wafer fab (Fab9) in Essex, VT. Additionally, process transfer and integration module development activities are part of our job. Reporting to the Fab9 Process Integration management, the primary responsibility of this position is to manage the BEOL part of an integrated CMOS process flow, drive improvements to enhance reliability, yield and manufacturability of this flow. This role is daytime hours, Monday through Friday, fully onsite.
Essential Responsibilities: - Identify and prioritize projects that align with strategic goals and objectives
- Lead and coordinate a team of up to 5 staff to assess risk and execute tasks to achieve the objective
- Exercise clear and concise communication of project status vs expected result
- Sustain and improve manufacturing technologies through identification of risk and risk mitigation strategies that include reducing defectivity, improving process stability (Cp/Cpk), improving process control and improving processes / processing sequences
- Detect and react to signals to support quality and delivery performance
- Drive appropriate actions to stop, contain, address the cause, and drive disposition
- Identify and drive cost reduction through improved yield, identify lower cost materials, simplified or improved process sequences, and migration to strategic platforms
- Transfer of technologies into or out of the fabricator
- Collaborate with technology development and process module teams to implement best practices into new technologies during development and qualification
- Identify, resolve, and improve process integration issues and related problems
- Perform project management and data analysis
- Work with cross function teams to resolve technical & yield concerns
- Develop and improve test structures that enable fast and rigorous characterization of process
- Drive CIP (Continuous improvement plans) to deliver organizational goals
- Work and collaborate other projects and/or assignments as needed
Other Responsibilities: - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
- Other duties as assigned by manager / supervisor
Required Qualifications: - Education: Bachelor of Science degree in Math, Mechanical Engineering, Electrical Engineering, Physics, or a related discipline + 6-7 years of semiconductor engineering manufacturing experience OR MS + 5-6 years semiconductor engineering manufacturing experience OR PhD + 3-4 years semiconductor engineering manufacturing experience
- Experience: Prior front end of line process integration experience, and/or MOL and BEOL experience
- Project management skills / team leadership experience - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity and influence without authority
- Fluency in English Language - both written & verbal
- Ability to work effectively and efficiently with diverse teams
- Strong structured problem-solving skills and experience
- Ability to apply principles of Statistical Process Control (SPC) and Design of Experiments (DOE)
- Strong leadership and communication skills
Preferred Qualifications: - Education: Master's degree in science, math, engineering, semiconductor manufacturing, or a related discipline
- Broad understanding of device integration including Aluminum & Copper Interconnect technology, Passive Device structures, and MIM Cap integration.
- Working device physics understanding
- Ability to analyze / characterize PCM and physical data in support of project identification and demonstration of improvement
- Knowledge of Lean Manufacturing principles
Expected Salary Range$98,000.00 - $176,000.00
The exact Salary will be determined based on qualifications, experience and location.
