Please Note: This role is a Hybrid role that requires 4 days onsite, 1 day working from home.
About the Role - Develops innovative solutions to support Intel's future technology roadmap.
- Drives design, simulation, development, and implementation activities for scientific research projects leveraging device physics, materials, chemistry, and process innovations to drive research on novel devices, packages, interconnects, circuits, and systems.
- Evaluates device, circuit, and system tradeoffs to identify solutions for continued performance improvements.
- Drives process and equipment research to enable device miniaturization and high-volume manufacturing.
- Provides process solutions across fabrication modules including lithography, etch, CVD, PVD, bonding, and CMP.
- Plans and executes experiments across fabrication sites in collaboration with cross-functional teams; benchmarks results against industry standards.
- Develops and validates models and measurements to advance device physics and packaging understanding.
- Manages vendor relationships supporting R&D across devices, packages, and interconnects.
- Mentors academic and industry partners to strengthen Intel's research pipeline.
Qualifications:The Minimum qualifications listed below are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience, academic projects, and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications- PhD degree in Materials Science, Chemistry, Physics, Chemical Engineering, Electrical Engineering or related field.
- Lead- and co-authored research publications in highly regarded, peer reviewed scientific journals and/or Conferences.
- 6+ months of experience with one or more of the following (having more than one will be preferred):
- Developing/maintaining deposition processes.
- Use of multiple metrologies to efficiently drive process improvement.
- Developing/maintaining process hardware.
- Project development in a team environment.
Preferred Qualifications- Thorough understanding of how to monitor and control processes.
- Working knowledge of standard semiconductor processes.
- Experience with modifying and controlling film properties to improve ease of integration.
- Experience with electrical test metrics and integration schemes.
- Experience with automating common tasks within automation systems.
- Demonstrated materials improvements from utilization of advanced AI/ML techniques.
- Previous experience in running vendor research collaborations.
Job Type:College Grad
Shift:Shift 1 (United States of America)
Primary Location:US, Oregon, Hillsboro
Additional Locations:BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
