Job Description
We are seeking a highly motivated and detail-oriented Engineering Project Manager (EPM) to drive development and fabrication of our next-generation Photonic Integrated Circuits (PICs). In this role, you will bridge the gap between cutting-edge optoelectronic design, our new photonic chip manufacturing facility, and system integration teams. You will coordinate cross-functional efforts to deliver high-performance PICs to power the world's fastest AI data center fabrics and coherent transport networks. This is an ideal role for one looking to accelerate their career in deep-tech hardware delivery.
Key Responsibilities
• Project Execution & Lifecycle Management: Own the execution schedule, milestones, and deliverables for PIC fabrication projects.
• Cross-Functional Coordination: Facilitate daily synchronization between optical design engineers, mask layout teams, internal fabrication operations, packaging specialists, and product management.
• Tool and Process Alignment: Partner closely with internal fabrication engineering teams and dedicated processing tool owners to optimize hardware queues, schedule critical preventative maintenance, and prevent line bottlenecks during engineering runs.
• Risk & Bottleneck Management: Proactively identify critical path dependencies, technical roadblocks, processing tool constraints, and material supply risks.
• Project Reporting: Maintain clear project dashboards. Communicate technical status, resource constraints, and key metrics regularly to senior leadership and engineering stakeholders.
Qualifications
Required Qualifications
• Education: Bachelor's or Master's Degree in Engineering, Physics, Optics, Materials Science, or a related technical/science discipline.
• Experience: Minimum of 2+ years of professional experience in a hardware engineering, product development, or project management role.
• Project Management Fundamentals: Proven experience managing project timelines, organizing complex technical deliverables, and utilizing project management software (e.g., Smartsheet, Jira).
• Communication: Exceptional verbal and written communication skills, with a demonstrated ability to translate complex hardware status into structured, actionable project updates.
Preferred & Desired Attributes
• Basic understanding of semiconductor manufacturing environments, cleanroom protocols, and the operational cadence of dealing with processing tools and wafer-handling coordination.
• Analytical Thinking: Skills to analyze requirements for completeness, consistency, and feasibility.
• Familiarity with semiconductor design lifecycles, particularly tape-out processes, cleanroom assembly, testing, or packaging.
• Direct exposure to InP substrates, fabrication processes, coherent optical subsystems, or fiber-optic communications systems is a significant plus, though strong execution skills remain the primary focus.
• An agile mindset with the ability to navigate shifting priorities in a fast-paced, R&D-heavy semiconductor environment.
