Engineer, Field Process (Hillsboro, OR)As a
Field Process Engineer, you will help expand ASM's advanced film technologies at a customer site in Oregon by developing, optimizing, and transferring innovative
ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. You will serve as the technical interface between customer engineering teams and ASM's global Business Unit, ensuring smooth and successful introduction of new products and processes. This role directly supports ASM's mission to accelerate next-generation semiconductor manufacturing through collaboration, technical excellence, and strong customer partnerships.
What you will be working on- Support New Product Introduction (NPI) by training with the Business Unit to gain deep expertise in new deposition processes and hardware
- Lead the introduction, qualification, and transfer of new processes to the customer site
- Partner closely with field hardware engineers and Business Unit teams to troubleshoot new products and develop process or hardware improvement proposals
- Design and execute on-site experiments with customers to support development, integration, and continuous improvement projects
- Escalate technical issues in a timely manner to maintain scope, timelines, and customer alignment
- Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams
- Analyze baseline system and process performance against technology-node requirements to identify gaps
- Perform structured problem solving and root-cause analysis on process or system nonconformances
- Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption
- Support process transfer to high-volume manufacturing (HVM) fabs, creating and maintaining best-known methods (BKMs) and documentation
- Maintain strong discipline around IP boundaries, customer communication, and escalation leadership
What we are looking for- MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics
- Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors through internships, research, or academic projects
- Demonstrated troubleshooting and structured problem-analysis skills (e.g., KT, FMEA, Ishikawa, 7-step methodologies)
- Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings
- Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin-film characterization
- Willingness and ability to travel for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations
- Strong written and verbal communication skills with the ability to clearly explain technical concepts
- Ability to maintain confidentiality and uphold IP boundaries
What sets you apart- Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment
- Demonstrated success optimizing deposition processes in research, pilot, or HVM-adjacent environments
- Exposure to customer-facing technical discussions, presentations, or reviews
- Experience supporting process transfer, scale-up, or qualification activities
- Proven ability to collaborate cross-functionally and contribute to structured action plans during technical challenges or escalations
