We are the R&D DRAM Device and Cell Technology Group at Micron, working at the heart of future memory scaling in an industry-leading 300mm R&D facility. We explore new device concepts, push the limits of DRAM cell performance, and turn deep physics understanding into manufacturable technology. If you enjoy learning fast, solving hard problems, and collaborating across process areas, this team delivers! In this role, you will play a critical part in defining and validating future DRAM device and cell technologies. As a Device Engineer, you will characterize memory arrays, analyze electrical behavior and failures, and influence process and material decisions that directly impact yield, quality, and performance. Your work will shape the electrical foundation of next-generation DRAM products. Responsibilities: • Define and drive electrical specifications for DRAM, Advanced DRAM and emerging memory technologies, translating product requirements into device-level targets for performance, reliability and scaling • Design, implement, and interpret experiments to optimize cell and access device performance. This includes running materials experiment, developing new integration schemes and defining new characterization methodologies • Develop physical and electrical models (TCAD and compact modeling) to identify performance, yield and reliability limiters, using advanced materials characterization, device physics insight, and statistical data analysis • Create and or improve stress methodologies to evaluate device reliability (e.g., TDDB, leakage, variability, endurance) and establish robust design margins. • Analyze array-level behavior using probe, parametric, and backend data to root-cause variability, optimize distributions, and improve yield, quality, and cost • Collaborate cross-functionally with process integration, design, and product engineering teams to translate device insights into technology and product improvements, enabling best-in-class memory solutions Minimum Qualifications: • MS with 5+ years of industry experience or PhD with hands-on research in Electrical Engineering, Physics, or related field • Strong expertise in semiconductor device physics including CMOS, diodes, and related devices • Deep knowledge of mainstream memory technologies such as DRAM, NAND, NOR, or SRAM • Experience with DRAM array characterization and failure analysis • Proficiency in data analysis, DOE, Agentic AI, and statistical techniques using tools such as JMP or Python Preferred Qualifications: • Strong written and verbal communication skills • Experience working across process integration and circuit or architecture domains • Demonstrated ability to collaborate with multi-functional engineering teams • Proven problem-solving skills and ability to communicate technical status to management As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.