Job DescriptionBecause of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full-time on site. This means work will be conducted on location at a BAE Systems facility 100% of the time.
Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely.
Position Summary:
BAE Systems is looking for a Bonding Process Engineer II to work in a fast-paced manufacturing environment at their Nashua, New Hampshire facility. Working closely with multi-disciplinary teams and being able to adapt to a rapidly changing production environment brings with it an exciting opportunity to influence the successful execution of production goals and achieving operational excellence. In this role, the process engineer will be responsible for process engineering, assembly process development, and new process implementation. Through hands-on problem solving, data analyses and application of Six Sigma and lean manufacturing principles, the process engineer will drive improvements in assembly processes, throughput and yields. You will serve as the subject matter expert, bridging the gap between engineering, product integration and stable, high yield manufacturing.
This is a first shift position working a 4/10 schedule with every Friday off!Responsibilities may include:
- Provides process engineering support on current production programs and supports overall manufacturing execution to meet cost, quality and delivery targets.
- Proactively identifies process improvements and engages with factory and program teams to implement process changes and continuous improvement initiatives for achieving operational excellence.
- Day to day support of the production floor activities, driving defect reduction, root cause activities, and daily interaction with technicians and operators.
- Analyze defect data to identify areas to improve yield and reduce defects.
- Participates in and documents customer corrective action requests using 9 Step problem solving methodology. Performs Preliminary Material Review/Material Review Board (PMR/MRB) for the disposition of discrepant material and determination of root cause/corrective action.
- Defines and specifies the requirement for assembly tooling, fixtures and equipment to support current manufacturing operations and recommends changes for production ramp-ups.
- Engage in continuous improvement initiatives.
- Supports the implementation of new automation assembly equipment including programming, process qualifications and supporting tooling design through the tooling group.
- Performs other duties as assigned.
Required Skills and Education- Education: Bachelor's Degree preferred OR 2+ years of experience in a mechanical engineering or related field, electronics assembly, or semiconductor packaging, preferrably wire/wedge bonding micro-electronic subassemblies.
- Technical Skills: Proven ability to understand, analyze and resolve complex technical problems. Preferably in programming autobonding equipment.
- Adaptability: Ability to maintain high quality and accuracy while working in a fast-paced, production-driven environment.
- Must be able to obtain a secret clearance
Preferred Skills and Education- Experience: 2+ years of direct experience wire/wedge bonding microelectronic subassemblies, preferably in programing autobonders (Palomar 8000/9000) & manual bonders (WestBond).
- Compliance Knowledge: Familiarity with strict quality and environmental standards such as MIL-STD-883, MIL-PRF-38534, ISO 9001, and AS9100. Prior experience working within a DoD environment, active or ability to acquire a secret security clearance. Relevant process engineering or manufacturing engineering industry experience, preferably in electro-mechanical manufacturing.
- Technical Proficiencies: Hands-on experience with wire bond equipment. Proficiency in CAD software (e.g., SolidWorks, AutoCAD).
- Analytical Skills: Demonstrated mastery of Design of Experiments (DOE), root cause analysis, and Statistical Process Control (SPC). Green Belt and Lean manufacturing training and demonstrated ability to apply these principles.
