Position Summary: We are looking for a Defect Metrology Process Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve AOI and Metrology processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.
Major Area of Accountability:- Coordinate the integration of our metrology systems into our site MES and automation systems.
- Implement and maintain metrology support systems, such as add-on software packages and data collection archiving.
- Ensure metrology supports multiple fab areas with thickness and defect measurements, inspection of pillar heights and location, as well as AFM and profilometry.
- Daily review of defects and SPC data for excursions, disposition and drive yield improvements in layout and process.
- Coordinate with appropriate engineering areas to report die pad locations through automation in fan-out wafer level packaging applications.
- Investigate and drive integration changes for improved device performance and yield improvement.
- Work with process and tool engineers to find processing marginalities and make improvements.
- The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required Qualifications:Education: BS, MS or PhD in Electrical Engineering, Electronics Engineering, or a related BS Engineering, MS/PhD preferred
Experience and Skills:- Fab processing tools knowledge/experience and how to support defect feedback to process owners.
- 8+ years' experience with BS, 5-8 years of experience with MS, 3+ years of experience with PhD in Electrical Engineering, Electronics Engineering, or a related in the semiconductor industry.
- Prior Defect inspection experience.
- MEMS/CMOS/Packaging inspection and metrology knowledge with relevant combination of years of experience and/or advanced degree.
- Knowledge of DOE, SPC, and 6-sigma concepts and applications.
- Project Management skills and/or defined training a plus.
- Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
- Can work both independently and in cross-functional teams for problem solving.
- US Citizenship Required:This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
The annual salary range for this role is $114,320 - $171,480. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
