In this role, you will own the quality engineering lifecycle for thermal management and mechanical components - including heat sinks, fans, chassis structures, and cooling assemblies - ensuring they meet Meta's reliability, performance, and manufacturability standards. You will partner closely with hardware design, supply chain, and manufacturing teams to drive component qualification, failure analysis, and continuous improvement programs that underpin the reliability of Meta's global infrastructure fleet.
Responsibilities
Lead component qualification activities for thermal and mechanical parts including fans, heat sinks, liquid cooling assemblies, chassis structures, and mechanical interconnects used in data center hardware
• Define and execute qualification test plans covering thermal performance, mechanical stress, vibration, shock, and environmental reliability in accordance with industry standards
• Conduct failure mode and effects analysis (FMEA) and root cause analysis (RCA) for thermal and mechanical component escapes, driving corrective and preventive actions with suppliers
• Collaborate with hardware design engineers to review component specifications, tolerance stack-ups, and thermal budgets to ensure design-for-reliability and design-for-manufacturability
• Develop and maintain component quality metrics, scorecards, and dashboards to track supplier performance and field reliability trends
• Partner with supply chain and supplier quality teams to assess new component suppliers, conduct supplier audits, and manage engineering change requests impacting thermal or mechanical performance
• Analyze field return data and reliability test results to identify systemic quality risks and implement risk mitigation measures across the component portfolio
• Contribute to setting team-level quality standards and qualification methodologies for thermal and mechanical components across infrastructure hardware programs
• Communicate component quality status, risk assessments, and qualification outcomes to hardware program teams and cross-functional stakeholders
• Identify opportunities to simplify and improve qualification processes, test coverage, and supplier engagement workflows to accelerate program timelines
Minimum Qualifications
• 6+ years of experience in component quality engineering, hardware reliability engineering, or mechanical/thermal engineering within a consumer electronics, data center, or server hardware environment
• 6+ years of experience with thermal and mechanical component qualification methodologies, including reliability testing standards such as JEDEC, IPC, ASTM, or equivalent
• Experience performing failure analysis techniques for mechanical and thermal components, including root cause investigation, corrective action development, and supplier engagement
• Experience with FMEA, tolerance analysis, and design-for-reliability principles applied to thermal management systems or mechanical assemblies
• Experience using data analysis to evaluate component reliability trends, qualification results, and supplier quality metrics to inform engineering decisions
Preferred Qualifications
• Familiarity with computational thermal simulation tools (e.g., CFD) or mechanical simulation tools (e.g., FEA) used to validate component performance
• Experience with liquid cooling systems, cold plates, or advanced thermal management technologies used in high-density computing or data center environments
• Background in developing qualification test plans and reliability specifications for custom or semi-custom hardware components in a hyperscale infrastructure context
• Experience conducting or supporting supplier quality audits and managing engineering change control processes for mechanical or thermal components
