Welcome! As a Staff CMP PD Engineer in our Technology Development Group based in Boise, you will identify, diagnose, and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology!
Additional responsibilities include coordinating and carrying out process, equipment, and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications, and managing, auditing, and collaborating closely with material suppliers to achieve quality, cost, and risk management objectives.
We are a part of a highly collaborative atmosphere, interacting with various groups such as process integration, electrical failure analysis, yield improvement, manufacturing, and equipment vendors, to ensure robust CMP processes that meet the detailed physical and electrical requirements for Micron products. You will grow into an experienced engineer, driving CMP technology roadmaps, which have a direct influence on Micron's global leadership in semiconductor manufacturing!
Responsibilities include, but not limited to:- Developing chemical mechanical planarization processes to meet the physical & electrical requirements of Micron's products.
- Optimizing CMP processes to reduce cost, process variability, and improve process capability.
- Collaborating with process integration and other process development teams to develop innovative new solutions.
- Conducting root cause and failure mode analysis to understand the limitations of current hardware, CMP consumable and drive CMP development projects with OEMs and consumable vendors for solutions.
- Performing fundamental research to drive innovative solutions for next-generation products.
- Maintaining a technology development pilot manufacturing line.
- Support process transfer to production facilities (some international travel may be required).
Minimum Qualifications: - M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields.
- 5+ years of semiconductor process engineering experience in CMP related process preferably in 300mm wafer fab.
- Experience in dielectrics/metals CMP process development with fundamental understanding of slurry/ pad interactions is desired.
- Experience in FEOL/ BEOL CMP process development and understanding of CMP related electrical/probe failure.
- Knowledge of semiconductor processing, solid-state device physics desirable.
Preferred Qualifications- Experience with design of experiment techniques (DOE), SPC, Defect analysis and data analysis
- Strong analytical and creative problem-solving skills.
- Ability to use extensive technical knowledge to guide strategic directions.
- Ability to resolve sophisticated issues through root-cause or model-based problem solving and willingness to Using AI
- Proficiency in statistics, preferably in statistical process control and hands on experience with CMP tools and endpoint systems.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
To learn more about Micron, please visit
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