Job Details:Job Description: We are seeking a talented and driven Process Integration Engineer to join our APTM Silicon Manufacturing Technology Development organization in Albuquerque, New Mexico, United States. In this role, you will play a pivotal part in enabling our advanced packaging manufacturing roadmap by developing and delivering upcoming technology nodes. You will serve as a key technical contributor, bridging process modules, device engineering, yield, and reliability teams to ensure that base die solutions are robust, manufacturable, and aligned with our long-term packaging strategy. This is an exciting opportunity to make a meaningful impact at the intersection of process development and high-volume manufacturing.
Key Responsibilities:
- Roadmap Enablement: Lead the development and integration of upcoming advanced packaging technology nodes, ensuring alignment with the APTM packaging roadmap and strategic manufacturing objectives
- Cross-Functional Collaboration: Partner closely with process module teams, device engineering, yield, reliability, and internal and external stakeholders to develop and deliver comprehensive base die solutions
- Defect & Yield Management: Own and drive closure of defect, yield (shipped and line), reliability, and device entitlement gaps, utilizing data-driven methodologies to identify root causes and implement sustainable corrective actions
- Process Development: Lead specific process development initiatives from concept through qualification, ensuring technical rigor and manufacturability at each stage of development
- PRI Enablement & Transfer Readiness: Actively support Process Readiness Initiative (PRI) enablement and manage transfer checklist progress to ensure processes are robust, documented, and ready for seamless transition to high-volume manufacturing
- Value Engineering: Identify and implement cost-effective process solutions through innovative thinking and value engineering principles, contributing to both technical performance and business competitiveness
- Technology Transfer: Collaborate with manufacturing teams to ensure successful knowledge transfer, process stability, and continuous improvement post-transfer
As a successful candidate, you must possess
- Collaborative Spirit — You thrive in team environments and naturally build strong working relationships across diverse groups and disciplines
- Effective Communication — You convey complex technical concepts clearly and confidently to both technical and non-technical audiences
- Adaptability — You remain composed and productive in a fast-paced, ever-evolving environment, embracing change as an opportunity
- Problem-Solving Mindset — You approach challenges with curiosity, creativity, and a structured, solutions-oriented attitude
- Ownership & Accountability — You take initiative, follow through on commitments, and hold yourself to a high standard of excellence
- Attention to Detail — You bring precision and thoroughness to your work, ensuring quality outcomes at every stage
- Innovative Thinking — You consistently look for smarter, better, and more efficient ways to achieve results
Are you ready to shape the future of semiconductor manufacturing? Join our world-class team in New Mexico, United States, and be part of a mission-driven organization where your expertise will directly influence next-generation packaging technologies. We offer a competitive compensation package, comprehensive benefits, and a dynamic work environment that champions growth, innovation, and collaboration.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Bachelor's degree in Engineering, Material Science, Physics, or a related specialized field, with 3+ years of relevant experience; or a Master's degree in one of these fields with 2+ years of relevant experience; or PhD in the same fields with no experience. Relevant experience for this position will be:
- Process integration, yield analysis, quality management or process development in high-volume manufacturing environments.
- Knowledge of semiconductor advanced packaging techniques and flows.
Preferred Qualifications:
- 3+ years of experience in value engineering and an innovative mindset to identify cost-effective solutions.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location: US, New Mexico, Albuquerque
Additional Locations:
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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