Job Details:Job Description: We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long-term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration.
Key Responsibilities:
- Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
- Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
- Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
- Partner with cross-functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
- Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
- Execute long-term strategies for module engineering to support future technology needs and market demands.
- Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
- Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
- Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.
As a Successful Candidate, You Will Bring:
- A Natural Leader — You inspire confidence, motivate teams, and bring out the best in the people around you.
- A Clear Communicator — You articulate complex ideas with clarity and adapt your communication style to diverse audiences.
- A Strategic Thinker — You see the big picture while staying grounded in the details that matter.
- A Collaborative Partner — You thrive in cross-functional environments and build strong relationships with stakeholders at all levels.
- A Coach and Mentor — You are genuinely invested in the growth and development of your team members.
- An Innovative Problem-Solver — You approach challenges with curiosity, creativity, and a solutions-oriented mindset.
- Resilient and Adaptable — You navigate ambiguity with composure and lead your team through change with confidence.
- Inclusive and Empathetic — You champion diversity of thought and create environments where everyone feels valued and heard.
Are you ready to lead a team that's shaping the future of semiconductor technology? Join Intel's WATD group in Hillsboro, Oregon, and make your mark on the technologies that connect and enrich lives worldwide.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master's degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
- Relevant experience can be any of the following:
- Semiconductor wafer or assembly process, equipment, or materials development.
- Process development methodology, project management, and schedule-based execution.
Preferred Qualifications:
- 4+ years of experience in:
- Metrology area
- Managerial position
- Wafer-level assembly or wafer-level packaging research and development.
- Technical leadership in process development for semiconductor manufacturing.
- Hybrid bonded interconnects (HBI), redistribution layer (RDL) packaging, and ultra-fine pitch solder connections.
- Lead programs from strategy formation through high-volume production.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location: US, Oregon, Hillsboro
Additional Locations:
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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