Position Summary:We are looking for a hardworking, passionate, and experienced Advanced Packaging Laminate and Bonding Process Engineer for our Florida Advanced Packaging site. This role will focus on Bonding and Lamination areas with owning and developing one or more critical process areas within our Advanced Packaging flow. Candidates with experience in semiconductor manufacturing, backend-of-line processing, or advanced packaging are well suited. In this role, you will lead, develop, and improve integrated process flows and collaborate closely with foundry customers, colleagues, and management. Strong communication skills are essential.
Major Area of Accountability:• Lead new process development, transfer, and integration activities in a manufacturing environment.
• Develop, optimize, and integrate robust manufacturable process recipes for Foundry customers in one or more key process areas.
• Provide technical ownership for the assigned module, including process stability, tool performance, defectivity, consumables evaluation, and continuous improvement.
• Support process integration for advanced packaging, MEMS, Photonic, or backend-of-line device flows.
• Utilize metrology and characterization tools to evaluate process conditions and drive improvements.
• Investigate and implement integration or process-flow changes to improve device performance, reliability, and yield.
• Work with process and equipment engineers to identify processing marginalities and implement corrective actions.
• Monitor in-line and end-of-line SPC charts for trends/excursions and drive data-based corrective actions.
• Support improvement of electrical test parametrics through process/integration modifications.
• Opportunity to grow toward Project Management responsibilities, integrating customer device or process requests.
• Perform other duties as assigned. Percentages of time spent on specific job duties may vary.
Required Qualifications:Education: 7-10 years experience with BS, 5-7 years experience with MS, 2+ years experience with PhD
Experience and Skills:- Hands-on experience with fab processing tools in advanced packaging process area.
- Prior experience working with wafer bonding and metal carrier / RDL laminate.
- Develop and optimize materials and process recipes for wafer bonding and laminate steps to enable next-generation advanced packaging.
- Knowledge of MEMS/Photonic devices or backend-of-line integration is a plus.
- Strong understanding of DOE, SPC, and 6-sigma concepts and their application.
- Clear, data-driven problem-solving capability with strong communication and documentation skills.
- Ability to work independently and in cross-functional teams.
US Citizenship Required:This position will require holding or the ability to obtain a government security clearance, which requires U.S. citizenship.
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The annual salary range for this role is $114,320 - $171,480. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
