Summary of Role: GlobalFoundries is seeking an experienced thermal, mechanical, and/or electrical modeler/engineer with demonstrated cryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. The engineer will leverage commercial multi-physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance.
Essential Responsibilities: - Demonstrated experience using commercial software to develop and correlate cryogenic thermal, mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions.
- Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.
- Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.
- Facilitate discussion with originating team to identify simulations that highlight critical process interactions and drive optimal 3DHI technology decisions.
- Apply commercial simulation software to mimic cryogenic semiconductor process flows and highlight the areas of concern.
- Extensive interaction with integration, device, and design engineers to assure development of a working technology.
Other Responsibilities: - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Other duties as assigned by manager.
Required Qualifications: - M.S. + minimum of 10 years of relevant experience.
- Semiconductor mechanical, thermal and/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications.
- Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency - English (Written & Verbal).
- Solid understanding of semiconductor processes and integration techniques.
- Good computer / software skills.
- Ability to clearly present results to small and large groups.
Preferred Qualifications: - PhD + 8 years of relevant experience.
- Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS...).
- Demonstrated work performance in an environment requiring a high level of attention to detail and timeliness.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
- Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning & organizational skills.
Expected Salary Range$118,000.00 - $239,000.00
The exact Salary will be determined based on qualifications, experience and location.
