Join a dynamic team to develop innovative thermal solutions for high-performance systems. Collaborate with experts, conduct simulations, and lead a talented group of engineers in creating cutting-edge designs that optimize cooling technologies.

Shape the future of ASIC packaging by leading signal and power integrity initiatives, ensuring optimal designs for high-performance systems through collaboration and innovation across engineering teams.

Lead the design and verification of advanced ASIC packaging, ensuring optimal power and signal integrity for high-speed applications across various platforms while mentoring teams and driving continuous improvement initiatives.

Pioneer AI innovation by leading research teams, shaping strategies, and translating advanced methodologies into scalable solutions, significantly impacting enterprise objectives and mentoring future AI talent.

Lead AI research initiatives to bridge theoretical methodologies with enterprise applications, shaping innovation across networking, security, and human-computer interaction while mentoring future talent.