The Principal Design Engineer for High Power Electronics is an individual contributor who will provide technical leadership at Jabil. The ideal candidate has experience developing devices/equipment for power distribution applications and tests; has strong technical understanding of power theory and technology trends.
Collaborate with SLAC colleagues to ensure the integration of LLRF with other accelerator subsystems such as the local and global control system and power RF systems. A seamless integration with beam physics modeling and implementation is also required.
Simulate electron optical performance of new designed electron optics system, modify and finalize the architecture design, and define requirement of electronic modules which support the electron optics system.
The Camera Electronics team develops image sensor and other silicon solutions and technologies for Apple's products, including the iPhone, iPad, MacBooks, and more.
Register Transaction Leve (RTL) design implementation, test case generation, modeling and debugging; provide constraints to logic synthesis team to translate design into gate level and fix timing issues before silicon tapeout.
Register Transaction Level (RTL) design implementation, test case generation, modeling and debugging; provide constraints to logic synthesis team to translate design into gate level and fix timing issues before silicon tape-out.
In this position, the individual will be responsible for designing, developing, modifying and evaluating Chip architecture and Core/Analog/Data Path circuit structures for feasibility study of high performance NAND flash, including new, most advanced 3-dimentional NAND memories.
In this position, the individual will be responsible for designing, developing, modifying and evaluating Analog/mix-signal IC of high performance NAND flash, including new, most advanced 3-dimentional NAND memories.
In this position, the individual will be responsible for designing, developing, modifying and evaluating Chip architecture and Core/Analog/Data Path circuit structures for feasibility study of high performance NAND flash, including new, most advanced 3-dimentional NAND memories.
Communicate between electrical and mechanical tools using IDF and IDX files; use of source control systems like perforce and subversion for file management and content replication.
Designs, develops, modifies and evaluates electronic parts, components or integrated circuitry for electronic equipment, or other hardware systems and/or electrical engineering applications.
The individual will evaluate from a reliability standpoint, materials, properties and techniques used in production and in qualification, advise design engineering on selection, application and test of electronic components and systems.
The Acoustics Design team is looking for someone who enjoys collaboration with high initiative and wants to make a significant engineering contribution to enable industry-leading electronic devices
The candidate will work to develop both low and high power electronic test equipment along with mentoring from several manufacturing test, and design engineering peers.
Toshiba America Electronic Components • San Jose, CA
Participate to the definition and deployment of the verification methodology. Take responsibility in the verification of the SSD controller blocks, sub-systems and top-level