Wirebond PLM & Automotive Market Leader - Semiconductor Packaging - Mandarin Speaking


San Diego, CA

Industry: Manufacturing


11 - 15 years

Posted 179 days ago

  by    Gary Daugenti

This job is no longer available.


Own the Wirebond Product Line. Drive related technology roadmapping and business

development activities in securing new customer engagements & design wins. Collaborate with R&D teams

to promote new products that are in development as well as provide direction for future development. Drive

the Automotive initiative by ensure our roadmap is positioned for success in this segment and

owning the related marketing collateral and efforts.

Key Job Accountabilities:

? Co-own with R&D our 5 year wirebond roadmap; understand OSAT customer (IC vendors)

roadmaps and use this to frame our technology roadmap

? Own marketing collateral related to Wirebond capabilities

? Identify target customers related to Wirebond for engagement and business development

? Own inputing Market Requirement Specifications (MRS) to R&D to launch new R&D projects as related

to Wirebond

? Own our Wirebond value proposition and ensure it is well represented in marketing collateral

? Co-own with MARCOM our website content related to Wirebond capability

? Own Sales/PDE training of our wirebond capability (2x/yr)

? Understand overall Wirebond industry landscape including OSAT TAM/SAM and OSAT competitive


? Support Sales/PDE in new customer development, particularly from the technology angle

? Own all of our Automotive related marketing collateral across all product offering areas.

? Train the technical part of the Sales team (PDE) in our Automotive offerings 2x/year.

? Ensure that our Product Offering roadmaps meet the emerging needs of the Automotive segment.

Education & Experience Requirements:

? 10+ year industry experience in wirebond packaging; Direct semiconductor packaging experience is

absolutely required.

? Experience in Automotive packaging required (need to understand the various Automotive certifications)

? Analog and Memory market segment background and credentials desired.

? Experience with advanced packaging (flip chip, wafer level packaging) desired.

? Minimum of a Master's Degree in an engineering field related to semiconductor packaging. MBA is good

but not required. Prior experience in business development preferred.

? Solid interpersonal and communication skills as will be communicating with individuals at all levels

inside and outside the organization.

? Result oriented, self-motivated and driven personality. Be able to drive successful results.

? Experience working in a highly dynamic business environment.

? Mandarin speaking desired.

$150K - $180K