Do you dream about using your expertise in films to push RAM technology beyond probability? At Micron that is just one of our passions! As a Thin Films Process Development Engineer at Micron Technology, Inc., we contribute at a high level as part of CVD/diffusion technology team to craft production-worthy, low cost processes, including CVD, ALD, diffusion, oxidations, RTP, and advanced anneals. We provide ownership for both process development & related tool issues for specific films/processes. You will be responsible for incorporating these processes into corresponding process flow for application in high density DRAM, FLASH and advanced memory parts. Let's innovate!
Responsibilities include, but not limited to:
- Translate product requirements into efficient processes and innovative solutions
- Develop, optimize and characterize thin film processes to meet the requirements of state of the art high-density DRAM
- Seek problems related to defect, yield and reliability issues
- Identify and strategize key thin film challenges for cutting-edge DRAM/Flash technology nodes
- Evaluate vendor tools and chemistries through collaboration and onsite evaluations
- Work directly with thin film equipment suppliers to develop new equipment and processes to meet Micron’s technological needs for sophisticated memory products
- Define and drive roadmap activities for next generation products
- Design experiments and execute the wafer processing, analyze and present data conclusions and recommendations to various partners
- Partner with material and equipment suppliers to ensure alignment with Micron’s internal EHSS requirements to build a safe working environment
- Transfer processes to HVM facilities, and ensure accurate documentation of requirements for equipment and facilities, metrology, quality control, and procedures
- Craft and monitor quality control plans including statistical process control (SPC) techniques
- Provide consultation to manufacturing on first of a kind equipment’s and processes after transfer to ensure successful yield ramp
- Master’s Degree and 5 to 10 years in Chemical Engineering or PhD 5+ years in Chemical Engineering, or Physics, Chemistry, Electrical Engineering or similar
- Deep understanding of engineering and science fundamentals
- Experience with, and understanding of surface analysis techniques like XPS, AFM, XRD, AES, EBSD, SIMS etc.
- In depth knowledge of chemical reaction engineering, thermodynamics, heat and mass transfer, plasma science and their direct application to thin film processes in various deposition methods
- An understanding of chemical kinetics and their direct application to diffusion, CVD, and ALD deposition processes in various deposition reactors
- The ability to analyze oxide quality using CV methods, mercury probe methods, SDI, probe data and reliability data (TDDB).
- Familiarity with MOSCAP device flow and electrical analysis techniques and data interpretation.
- Understanding of thin film processes and tool variables affecting the physical, chemical and electrical properties of deposited films
- You are ambitious and dedicated to collaborating effectively in a dynamic environment
- Strong communication skills both written and verbal