Sr Packaging Engineer

Qorvo, Inc   •  

Greensboro, NC

Industry: Technology

  •  

5 - 7 years

Posted 168 days ago

This job is no longer available.

Responsibilities:

  • Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
  • Characterize materials to help develop new processes for next generation products.
  • Utilize program management methodology to plan, execute and monitor complex process and/or product development projects with a cross-functional global engineering team.
  • Strong networking across the industry to development relationships with key suppliers and help keep abreast of industry technology trends.
  • Team member helping to develop and deploy Semiconductor Packaging materials, processes and products.
  • Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaAs, GaN, Si and Acoustic semiconductor devices into products

Qualifications:

  • Thorough knowledge in the measurement of electrical and mechanical material properties utilized in semiconductor packaging. Capable of utilizing test methods such as DSC, TMA, DMA, TGA, Rheometer, Network Analyzer, etc.
  • Strong background in processes and packaging technologies preferably with direct experience in either RF Modules, SiP, WLFO, or high power / high frequency packages.
  • Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminates, EM Shielding, etc.
  • Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
  • Experience with Program Management Methodology.
  • 5+ years’ direct experience in semiconductor packaging.
  • MS, or higher in Material Science or Engineering

Job ID: 0007773