Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
Characterize materials to help develop new processes for next generation products.
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects with a cross-functional global engineering team.
Strong networking across the industry to development relationships with key suppliers and help keep abreast of industry technology trends.
Team member helping to develop and deploy Semiconductor Packaging materials, processes and products.
Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaAs, GaN, Si and Acoustic semiconductor devices into products
Thorough knowledge in the measurement of electrical and mechanical material properties utilized in semiconductor packaging. Capable of utilizing test methods such as DSC, TMA, DMA, TGA, Rheometer, Network Analyzer, etc.
Strong background in processes and packaging technologies preferably with direct experience in either RF Modules, SiP, WLFO, or high power / high frequency packages.
Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminates, EM Shielding, etc.
Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
Experience with Program Management Methodology.
5+ years’ direct experience in semiconductor packaging.