$80K - $100K(Ladders Estimates)
San Diego, CA 92101
Industry: Telecommunications & Hardware•
Less than 5 years
Posted 76 days ago
Member of a package characterization and applications lab team supporting the assembly, test, and analysis of advanced IC packages.
Define and execute experimental DOEs related to package level and board level stress testing.
Perform PCB assembly and troubleshooting.
Perform material analysis and physical failure analysis.
Analyze results and prepare technical reports.
Design test jigs as necessary.
Maintain, upgrade and troubleshoot assembly and test equipment.
Provide guidance to technicians on performing the set-up, calibration, testing and troubleshooting of test solutions and assemblies.
Opportunity to develop new methods and procedures to evaluate new technologies.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
Minimum Qualifications The candidate will possess 2+ years of experience in:
PCB assembly (SMT, soldering)
PCB and/or device level mechanical testing.
Experience with test equipment such as temperature cycling, mechanical shock and vibration, material and load testing.
Knowledge of and ability to follow industry specification such as ASTM, MIL-STD, JEDEC, IPC, ISO, AEC.
Proficient in MS-Office (Excel, Powerpoint, Word).
Preferred Qualifications Previous experience in physical failure analysis, including cross-sectioning and dye-and-pry techniques, SEM imaging
Component warpage testing
Material analysis such TMA, DMA, DIC.
Education Requirements Required: 2-year technical degree with relevant work experience.
Preferred: 4-year degree in engineering or related technical discipline.
Valid Through: 2019-8-27