Senior Staff Signal Integrity Hardware Engineer

Confidential Company  •  Tempe, AZ

5 - 7 years experience  •  Business Services

Salary depends on experience
Posted on 09/22/17
Confidential Company
Tempe, AZ
5 - 7 years experience
Business Services
Salary depends on experience
Posted on 09/22/17

Description

Kforce has a client seeking a Senior Staff Signal Integrity Hardware Engineer in Tempe, Arizona (AZ). Summary: Engineer will be part of a team of Engineers bringing highly complex, dense, rugged and secure microelectronic packaging solutions. The Signal Integrity / Package design Engineering team supports all our current and future product developments. Major product technologies developed at the client's site include DRAM, NAND, NOR, MCM's and SSDs with focus on the military / government markets. The SI/Packaging team owns all steps of the signal and power integrity support process including die and package model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support. Responsibilities:

  • Design and model high-end packages that are optimized for signal and power integrity
  • Explore new solutions such as High Density Interconnects, Interposers, and package-on-package (PoP)
  • Developing unique signal and power solutions based on design objectives of performance and cost
  • Selection of appropriate signaling and interconnect technology for high performance interfaces
  • Power integrity analysis for each PWR/GND domain: package extraction, simulation & decoupling strategy
  • PDN Methodology Development: Simultaneous switching noise/output (SSN or SSO) analysis for each I / O PWR / GND domain
  • Selection of appropriate signaling and interconnect technology for high performance interfaces
  • Optimal layer stackup & PWR / GND plane / island assignment to minimize voltage drop / noise / coupling
  • Definition and simulation of high speed interconnects using simulation tools
  • Crosstalk analysis and reduction

Requirements

  • 5+ years of package design experience in high speed / RF / DDR designs, circuit and package modeling, and extractions
  • Thorough understanding of all aspect of package design and relationship between physical layout and electrical performance
  • Experience and working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Ansys HFSS, Sigrity PowerSI / Speed2000 / XtractIM, Mentor Graphic Hyperlynx, HSPICE S-parameter extraction and simulation
  • Solid understanding of electromagnetic and transmission line theory, general I / O design, signal integrity, differential and single ended interface technologies
  • Clear understanding of power distributionnetwork design and optimization techniques
  • Self-motivated - candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal communication skills, and can work well in a diverse team environment

JobID: 1660680-WQG

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