$80K — $100K *
We are looking for a Senior Process Engineer who will be responsible to drive development of innovative packaging technologies for Tektronix Component Solutions’ advanced 2.5D/3D devices. The successful candidate will work in collaboration with external wafer foundries to develop back-end processes, and develop assembly processes for advanced CMOS nodes, stacked die assemblies, interposer technologies and other emerging packaging technologies for highly integrated multi-chip module products with silicon and III-V compound semiconductors. They will have experience with Thermo-compression bonding, fcCSP, copper pillar, and eutectic attach. They will be responsible for defining package design rules and assembly rules to meet manufacturability and yield requirements. They will work in a cross-functional team to ensure developed processes maintain high yield in a high-compliance manufacturing environment, including quality and reliability industry standards for military applications.
Valid through: 6/10/2021