Senior Optoelectronics Packaging Engineer


Cambridge, MA

Industry: Hardware


5 - 7 years

Posted 244 days ago

This job is no longer available.

Job Description:

?       Design optical coupling interfaces for silicon photonics packaging platform focused on coupling of optical fiber and sources to silicon waveguide structures.



?       Design of optical packaging system for single mode optical fiber coupling to silicon photonic waveguide structures

?       Design of optical packaging system for source coupling to silicon photonic waveguide structures

?       Evaluation of design for reliability, manufacturing, and assembly

?       Hands-on experience in construction and evaluation of optical coupling devices, including fixture design

?       Interface with suppliers in support of specification, quoting, fabrication and evaluation of the components

?       Assist with the documentation (drawings) for product components, including models, production drawings, inspection criteria, etc.

?       Incoming inspection of first article parts to evaluation supplier compliance to the drawing & quality

?       Interact with cross-functional team, including manufacturing, supply line and marketing organizations

?       Some travel (<10%) will be required, including some international travel



?       MS or PhD in mechanicalengineering, physics, optics, materials science or related discipline required

?       Minimum of 5years of related experience in area of optical components and fiber optics, preferably in silicon photonics Software Solidworks required, Zemax or FEA experiencedesired

?       Expertise in design of opto-mechanical products with sub-micron tolerances, having previously transferred designs to manufacture

?       Lab experience with optical measurements and optical test equipment desired

?       Self-motivated team player with strong communication skills



?       Create packaging designs that provide optimum configurations of competing requirements: thermal, mechanical, electrical, and optical

?       Thermal and mechanical stress modeling

?       Collaborate with Rockley?s device designers and process engineers, as well as external suppliers and CM?s, to provide designs and manufacturing processes optimized for cost, reliability and throughput

?       Define component specifications and locate and develop suppliers

?       Prove the feasibility of the package design and the assembly process by designing experiments, and overseeing prototype build and reliability and stress testing

?       Supportpilot production builds

?       Manage the transfer of product packaging to manufacturing at CM's and OSAT's

?       Analyze yield and throughput data for early production and drive improvements in the design and process



?       Thermal and mechanical modeling of optical and/or electronics packages

?       Demonstrated strength in material selection

?       Successful transfer to manufacturing of photonics package designs and processes

?       Working knowledge of die handling and bonding equipment, methods, and materials (wire bonding, flip chip, solder, epoxy, etc.)


Educational Requirements:

?       MSc or PhD in related field or

?       BSc and 3years?experience in related field


Reference # 8101 - Beverly A. Kahn, Founder/President