Semiconductor Packaging Engineer

Industry: Aerospace & Defense


Less than 5 years

Posted 53 days ago

This job is no longer available.

Job Description: Science Systems and Applications, Inc (SSAI) has an exciting opportunity for an experienced Semiconductor Packaging Engineer to join our team, in support of the Electrical Systems Engineering Services III (ESES III) contract at Goddard Space Flight Center (GSFC) in Greenbelt, MD.

The ESES IIIcontract is tasked with providing a broad range of engineering and related services to the GSFC Electrical Engineering Directorate asrequired, for the formulation, design, development, fabrication, integration, testing, verification, and operations of space flight and ground system hardware and software, including development and validation of new technologies insupportof NASA’s current and future space flight and ground system projects.

SSAI has a long history at NASA GSFC as a leading provider of science and engineering services throughout all phases of the program life cycle and across the entire space systems architecture, including space and ground assets.

Required Qualifications:

  • B.S. in Electrical Engineering, Physics or Material Science
  • 2-5 years’ experience in industry or research laboratory environment, or equivalent combination of education and experience
  • Awareness of encapsulation failures, e.g., water transport, diffusion processes, and galvanic and electrolytic corrosion.
  • Experience with advanced electronic or MEMS packaging and materials
  • Familiarity with die attach, wire bonding, encapsulation, flip chip, and hermetic sealing, conductive epoxies, underfill, solders, encapsulates
  • Working knowledge of electrical engineering & signal routing/optimization
  • Must be a US Citizen or Permanent Resident

Desired Qualifications: M.S. in Electrical Engineering, Physics or Material Science, preferred.