As a Physical Vapor Deposition (PVD) Equipment Engineer with Broadcom Limited’s Wireless Semiconductor Division (WSD), you will own and support equipment used to develop advanced processes in our state of the art 6” and 8” wafer fabrication facility located along the Front Range Mountains in Northern Colorado. You will team with Technology Development and Process Engineering to achieve this objective. The team will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping them into high volume manufacturing. Fabrication technologies will include silicon based MEMS and compound semiconductor active devices. Primary focus will be on Physical Vapor Deposition equipment.
- Provide technical leadership in identifying, evaluating, improving and maintaining equipment.
- New equipment selection, acceptance and start-up as well as hardware and software optimization; conferring with equipment vendors and manufacturing engineers at -Broadcom.
- Existing equipment upgrade and 6” à 8” tool conversion with qualification support.
- Develop and implement preventative, predictive and high precision maintenance procedures. Implementation includes documenting procedures, as well as training and certifying personnel.
- Work with peers and the unit process engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects. Organizes and manages longer term improvement projects to meet organizational goals.
- Collaborate with Process Engineering, Equipment Maintenance and Manufacturing Operations to achieve robust performance in support of yield, quality, cost and productivity goals; reporting and ownership of related projects and metrics.
- Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).
- BS in EE, ME, ChemE, Materials Science and a minimum of 5 years of experience as an engineer supporting PVD equipment in a MEMS/semiconductor HVM environment.
- Experience with thin film PVD equipment is highly preferred.
- Detail oriented with strong fundamentals in core equipment engineering functions.
- Excellent diagnostic and troubleshooting skills for process/equipment interactions.
- Practical experienceapplying structured problem solving methods.
- Working knowledge and practical experience with SPC, DOE and statistical hypothesis testing.
- Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access.
- Excellent verbal and written skills. Commitment to effective communication.
- Initiative to address and appropriately escalate problems to achieve rapid resolution.
- Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.
- Basic understanding of MEMS and active device micro-fabrication techniques is highly desirable.
- Legal authorization to work in the US.