Principal Product Validation Engineer

Cadence Design Systems   •  

Chelmsford, MA

Industry: Information Technology

  •  

5 - 7 years

Posted 64 days ago

This job is no longer available.

We are seeking a passionate and motivated engineer to join our Development team in support of the Allegro PCB and IC packaging product lines. This position is part of a multi-faceted team comprised of design disciplines including: MCAD, Signal Integrity, Thermal, Logical Capture, PCB Design and IC packaging.

This position is responsible for the verification of the end users experience, to ensure our products exceed the user's expectations. There is tremendous opportunity for growth in this position working directly with experts in each of these fields.

Title: Principal Product Validation Engineer

Location: Chelmsford, MA

Must haves:

  • 4-6 years' experience in IC packaging design domain
  • Understanding of wirebonding, flipchip and stacked die packaging technologies
  • Experience with component packaging tools

Duties:

  • Understanding of physical and spacing constraints for fabrication of IC packaging
  • Understanding of wirebonding, flipchip and stacked die packaging technologies
  • Strong understanding of various via constructions
  • Must have strong communication skills oral and written
  • Ability to lead and work well in team environment
  • Evaluation of product/feature requirements, examination and functional specifications sign-off, authoring of test plans, test automation support, authoring of bug reports.

Plus Items:

  • Tool experience: Allegro PCB Designer, Xpedition, Altium, AutoCAD, Any logical capture tool
  • Design Experience: Production validation sign-off, various physical package types, RF, analog, high power, low power, PCB layout
  • Programming experience: Node.js, Java, Pearl, python, Cadence SKILL, Web design
  • Platform experience: Windows 7,10; SLES:11,12, Centos 6, RH 6.x, RH7.x
  • Willing to participate in programming and creating custom scripts within our environment
  • Understanding of manufacturing output data required for fabrication, assembly and test of component packaging processes

Education:

  • BTech Degree and equivalent