Principal MEMS Product Manager

KForce   •  

Phoenix, AZ

Industry: Professional, Scientific & Technical Services


5 - 7 years

Posted 94 days ago

This job is no longer available.


Kforce has a client seeking a Principal MEMS Product Manager in Phoenix, Arizona (AZ). Responsibilities:

  • Grow the MEMS Product line while maintaining corporate profitability guidelines
  • This position requires extensive interaction at all levels within the company as well as with different customers, pushing marketing' efforts of product offerings and finally ownership of the translation of the product pricing quotes into design wins toward revenue-generating products
  • Promote company's MEMS package technologies to new and existing customers to find potential applications to gain and win more business
  • Collect, analyze and understand product market intelligence to integrate into a strategy to win in target markets
  • Generate customer product pricing quotes and work closely with Sales to win the business
  • Build product/customer knowledge and strategy to ensure realistic market pricing
  • Work closely with factories in creating package/process risk assessments with risk mitigation plans on new products while generating overall development schedule that will align with the customer
  • Work with company's R&D and factories in developing new products, new material/process capability, cost reduction projects, and transfer of new packaging technologies to production ensuring the most efficient and low-cost products
  • Management of factory relationships to ensure line efficiencies, equipment allocation/management and product quality assurance


  • Bachelor's or Master's degree or equivalent in Engineering with 6-8+ years of work experience in the semiconductor industry
  • Experience with cost modeling, pricing, quoting activities and products would be beneficial
  • Exhibit extremely organized technical project management experience (preferably, involving offshore factories) and the ability to multiplex across numerous programs and teams
  • Demonstrated ability to work independently in a heavily matrixed organization
  • Needs to be self-driven and very motivated to adapt and overcome obstacles across different groups/organizations; assuming ownership of the program's success
  • Solid knowledge of semiconductor packaging design, materials, substrate, development methodology, manufacturing methods and various package form factors; MEMS knowledge
  • Strong communication (written and verbal), organizational and interpersonal skills
  • Frequent face-to-face and teleconference technical presentations to customers
  • Proficiency with Microsoft Office (PowerPoint, Excel, Project, Word, Outlook, etc.)
  • Position requires approximately 15% domestic and 15% international travel

Preferred Qualifications:

  • Knowledge of material and package characterization, simulations, data analysis, reliability test method and qualification procedures
  • Familiarity with Design of Experiments and Statistical Process Control (JMP)
  • Familiarity with ACAD and other package design software

JobID: 1750213-WQG